Application of the Mixed-mode Bending Fracture Test for Electronic Packaging Materials

YILDIRIM B., HYDRO R. M., NIED H. F.

SEM Spring Conference on Experimental Mechanics, Washington, Kiribati, 2 - 04 June 1997, pp.21-22

  • Publication Type: Conference Paper / Full Text
  • City: Washington
  • Country: Kiribati
  • Page Numbers: pp.21-22
  • Hacettepe University Affiliated: Yes