B. YILDIRIM Et Al. , "Application of the Mixed-mode Bending Fracture Test for Electronic Packaging Materials," SEM Spring Conference on Experimental Mechanics , Washington, Kiribati, pp.21-22, 1997
YILDIRIM, B. Et Al. 1997. Application of the Mixed-mode Bending Fracture Test for Electronic Packaging Materials. SEM Spring Conference on Experimental Mechanics , (Washington, Kiribati), 21-22.
YILDIRIM, B., HYDRO, R. M., & NIED, H. F., (1997). Application of the Mixed-mode Bending Fracture Test for Electronic Packaging Materials . SEM Spring Conference on Experimental Mechanics (pp.21-22). Washington, Kiribati
YILDIRIM, BORA, R M HYDRO, And Herman F NIED. "Application of the Mixed-mode Bending Fracture Test for Electronic Packaging Materials," SEM Spring Conference on Experimental Mechanics, Washington, Kiribati, 1997
YILDIRIM, BORA Et Al. "Application of the Mixed-mode Bending Fracture Test for Electronic Packaging Materials." SEM Spring Conference on Experimental Mechanics , Washington, Kiribati, pp.21-22, 1997
YILDIRIM, B. HYDRO, R. M. And NIED, H. F. (1997) . "Application of the Mixed-mode Bending Fracture Test for Electronic Packaging Materials." SEM Spring Conference on Experimental Mechanics , Washington, Kiribati, pp.21-22.
@conferencepaper{conferencepaper, author={BORA YILDIRIM Et Al. }, title={Application of the Mixed-mode Bending Fracture Test for Electronic Packaging Materials}, congress name={SEM Spring Conference on Experimental Mechanics}, city={Washington}, country={Kiribati}, year={1997}, pages={21-22} }