Finite element modeling of solder joint fatigue in four-point bending test

Sabuncuoglu B., Vanhee F., Willems G., Vandevelde B., Vandepitte D., De Wolf I.

2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2012, Cascais, Portugal, 16 - 18 April 2012, (Full Text) identifier

  • Publication Type: Conference Paper / Full Text
  • Doi Number: 10.1109/esime.2012.6191801
  • City: Cascais
  • Country: Portugal
  • Hacettepe University Affiliated: No