B. Sabuncuoglu Et Al. , "Finite element modeling of solder joint fatigue in four-point bending test," 2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2012 , Cascais, Portugal, 2012
Sabuncuoglu, B. Et Al. 2012. Finite element modeling of solder joint fatigue in four-point bending test. 2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2012 , (Cascais, Portugal).
Sabuncuoglu, B., Vanhee, F., Willems, G., Vandevelde, B., Vandepitte, D., & De Wolf, I., (2012). Finite element modeling of solder joint fatigue in four-point bending test . 2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2012, Cascais, Portugal
Sabuncuoglu, BARIŞ Et Al. "Finite element modeling of solder joint fatigue in four-point bending test," 2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2012, Cascais, Portugal, 2012
Sabuncuoglu, BARIŞ Et Al. "Finite element modeling of solder joint fatigue in four-point bending test." 2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2012 , Cascais, Portugal, 2012
Sabuncuoglu, B. Et Al. (2012) . "Finite element modeling of solder joint fatigue in four-point bending test." 2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2012 , Cascais, Portugal.
@conferencepaper{conferencepaper, author={BARIŞ SABUNCUOĞLU Et Al. }, title={Finite element modeling of solder joint fatigue in four-point bending test}, congress name={2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2012}, city={Cascais}, country={Portugal}, year={2012}}