Finite Element Modelling of the Mixed-mode Bending Fracture Test for Electronic Packaging Materials

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YILDIRIM B., Nied H. F.

SEM Spring Conference on Experimental Mechanics, Washington, Kiribati, 2 - 04 June 1997, pp.23-24

• Publication Type: Conference Paper / Full Text
• City: Washington
• Country: Kiribati
• Page Numbers: pp.23-24
• Hacettepe University Affiliated: Yes