B. YILDIRIM And H. F. Nied, "Finite Element Modelling of the Mixed-mode Bending Fracture Test for Electronic Packaging Materials," SEM Spring Conference on Experimental Mechanics , Washington, Kiribati, pp.23-24, 1997
YILDIRIM, B. And Nied, H. F. 1997. Finite Element Modelling of the Mixed-mode Bending Fracture Test for Electronic Packaging Materials. SEM Spring Conference on Experimental Mechanics , (Washington, Kiribati), 23-24.
YILDIRIM, B., & Nied, H. F., (1997). Finite Element Modelling of the Mixed-mode Bending Fracture Test for Electronic Packaging Materials . SEM Spring Conference on Experimental Mechanics (pp.23-24). Washington, Kiribati
YILDIRIM, BORA, And Herman F Nied. "Finite Element Modelling of the Mixed-mode Bending Fracture Test for Electronic Packaging Materials," SEM Spring Conference on Experimental Mechanics, Washington, Kiribati, 1997
YILDIRIM, BORA And Nied, Herman F. . "Finite Element Modelling of the Mixed-mode Bending Fracture Test for Electronic Packaging Materials." SEM Spring Conference on Experimental Mechanics , Washington, Kiribati, pp.23-24, 1997
YILDIRIM, B. And Nied, H. F. (1997) . "Finite Element Modelling of the Mixed-mode Bending Fracture Test for Electronic Packaging Materials." SEM Spring Conference on Experimental Mechanics , Washington, Kiribati, pp.23-24.
@conferencepaper{conferencepaper, author={BORA YILDIRIM And author={Herman F Nied}, title={Finite Element Modelling of the Mixed-mode Bending Fracture Test for Electronic Packaging Materials}, congress name={SEM Spring Conference on Experimental Mechanics}, city={Washington}, country={Kiribati}, year={1997}, pages={23-24} }