Yayınlar & Eserler

Yayın Ağı
Makaleler 3
Tümü (3)
SCI-E, SSCI, AHCI (3)
SCI-E, SSCI, AHCI, ESCI (3)
Scopus (3)

1. Fine-grained Classification of Solder Joints with α-skew Jensen-Shannon Divergence

ÜLGER F., Yuksel S. E., YILMAZ A., GÖKCEN D.
IEEE Transactions on Components, Packaging and Manufacturing Technology , cilt.13, sa.2, ss.257-264, 2023 (SCI-Expanded, Scopus) identifier identifier

2. Solder Joint Inspection on Printed Circuit Boards: A Survey and a Dataset

ÜLGER F., Yuksel S. E., YILMAZ A., GÖKCEN D.
IEEE Transactions on Instrumentation and Measurement , cilt.72, 2023 (SCI-Expanded, Scopus) identifier identifier

3. Anomaly Detection for Solder Joints Using beta-VAE

ÜLGER F., YÜKSEL ERDEM S. E., YILMAZ A.
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY , cilt.11, sa.12, ss.2214-2221, 2021 (SCI-Expanded, Scopus) Creative Commons License identifier identifier identifier
Hakemli Bilimsel Toplantılarda Yayımlanmış Bildiriler 1

1. A Standalone Open-Source System for Optical Inspection of Printed Circuit Boards

ÜLGER F., Yuksel S. E.
23rd IEEE Conference on Signal Processing Algorithms, Architectures, Arrangements, and Applications (SPA), Poznan, Polonya, 18 - 20 Eylül 2019, ss.105-110, (Tam Metin Bildiri) identifier identifier
Metrikler

Yayın

4

Yayın (WoS)

4

Yayın (Scopus)

4

Atıf (WoS)

37

H-İndeks (WoS)

2

Açık Erişim

1