Effect of gradual widening of d/w-ratio on optical performance of photon sieves produced by two maskless lithography techniques: lift-off and chemical etching

Ruzgar K., BACIOĞLU A.

JOURNAL OF MODERN OPTICS, vol.67, no.15, pp.1304-1313, 2020 (SCI-Expanded) identifier identifier

  • Publication Type: Article / Article
  • Volume: 67 Issue: 15
  • Publication Date: 2020
  • Doi Number: 10.1080/09500340.2020.1844911
  • Journal Indexes: Science Citation Index Expanded (SCI-EXPANDED), Scopus
  • Page Numbers: pp.1304-1313
  • Keywords: Photon sieve, d, w ratio, super-resolution, Fresnel zone plate, diffractive optics, individual far field model, X-RAY MICROSCOPY, FABRICATION, FIELD
  • Hacettepe University Affiliated: Yes


The two important parameters, to evaluate the performance of the photon sieves quantitatively, are the intensity and resolution at the focus plane. Both high-intensity and super-resolution depend on the ratio of the diameter (d) of each pinhole to the width (w) of the related Fresnel zone: the d/w ratio. The size deviations in the produced pinholes may adversely affect the optical performance of the photon sieves. The mispositioned and imperfectly-shaped pinholes cause the super-resolution at the focus to be disrupted. The photon sieves are produced by using two sub-methods of maskless lithography: lift-off and wet chemical etching. Although designed to be constant of 1, the d/w ratio was measured to widen gradually for both chemical-etched and lift-off samples. It is revealed the optical performance of the photon sieves may be enhanced as a result of gradual increase of the d/w ratio, compared to the structure of constant d/w ratio.