Selcuk Dental Journal, cilt.6, sa.1, ss.30-37, 2019 (Hakemli Dergi)
Comparison of different universal adhesives’ bond
strength to laser-assisted bleached enamel
Background: The aim of this in vitro study was to evaluate the
bond strength of several universal adhesives used in different
application modes to laser-assisted bleached enamel.
Materials and Methods: Freshly extracted 72 sound bovine
incisors were used for the study. The teeth were bleached with
38% of hydrogen peroxide gel that was activated with a Diode
Laser (Epic). The Diode Laser with a 949nm wavelength was
used at 7 W in continuous mode for 30 s. After bleaching
procedure, the teeth were kept in artificial saliva for 2 weeks.
The bleached teeth were randomly assigned into three groups
according to different universal adhesive systems (n=24);
Single Bond Universal, All-Bond Universal and Adhese
Universal. All adhesives were applied in two modes: aetch&rinse; and b- self etch. A cylinder-shaped resin composite
was placed on treated surfaces and cured. After storage of
specimen in distilled water for 24 h, they were subjected to
shear bond strength test. Data were analyzed using two-way
ANOVA followed by Bonferroni test (α = 0.05).
Results: The highest mean shear bond strength values were
obtained in Single Bond Universal group which was used in
self-etch mode (p<0.05). No difference was observed between
All-Bond Universal and Adhese Universal. In etch&rinse
application mode, Adhese Universal resulted in significantly
lower bond strength values (p<0.05) than Single Bond
Universal and All-Bond Universal. For all groups, etch&rinse
application mode caused significantly higher bond strength
values.
Conclusion: The bonding performance of tested universal
adhesives at etch&rinse mode after Diode Laser-assisted
bleaching to enamel was superior than self-etch mode
application.