ÜLGER, F. Et Al. 2023. Solder Joint Inspection on Printed Circuit Boards: A Survey and a Dataset. IEEE Transactions on Instrumentation and Measurement , vol.72 .

ÜLGER, F., Yuksel, S. E., YILMAZ, A., & GÖKCEN, D., (2023). Solder Joint Inspection on Printed Circuit Boards: A Survey and a Dataset. IEEE Transactions on Instrumentation and Measurement , vol.72.

ÜLGER, FURKAN Et Al. "Solder Joint Inspection on Printed Circuit Boards: A Survey and a Dataset," IEEE Transactions on Instrumentation and Measurement , vol.72, 2023

ÜLGER, FURKAN Et Al. "Solder Joint Inspection on Printed Circuit Boards: A Survey and a Dataset." IEEE Transactions on Instrumentation and Measurement , vol.72, 2023

ÜLGER, F. Et Al. (2023) . "Solder Joint Inspection on Printed Circuit Boards: A Survey and a Dataset." IEEE Transactions on Instrumentation and Measurement , vol.72.

@article{article, author={FURKAN ÜLGER Et Al. }, title={Solder Joint Inspection on Printed Circuit Boards: A Survey and a Dataset}, journal={IEEE Transactions on Instrumentation and Measurement}, year=2023}