Sabuncuoglu, B. Et Al. 2017. Evaluation of Fatigue Behavior of Lead-Free Solder Joints in Four-Point Bending Test by Finite-Element Modeling. IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY , vol.7, no.12 , 1957-1964.

Sabuncuoglu, B., VANHEE, F., WİLLEMS, G., VANDEVELDE, B., & VANDEPİTTE, D., (2017). Evaluation of Fatigue Behavior of Lead-Free Solder Joints in Four-Point Bending Test by Finite-Element Modeling. IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY , vol.7, no.12, 1957-1964.

Sabuncuoglu, BARIŞ Et Al. "Evaluation of Fatigue Behavior of Lead-Free Solder Joints in Four-Point Bending Test by Finite-Element Modeling," IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY , vol.7, no.12, 1957-1964, 2017

Sabuncuoglu, BARIŞ Et Al. "Evaluation of Fatigue Behavior of Lead-Free Solder Joints in Four-Point Bending Test by Finite-Element Modeling." IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY , vol.7, no.12, pp.1957-1964, 2017

Sabuncuoglu, B. Et Al. (2017) . "Evaluation of Fatigue Behavior of Lead-Free Solder Joints in Four-Point Bending Test by Finite-Element Modeling." IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY , vol.7, no.12, pp.1957-1964.

@article{article, author={BARIŞ SABUNCUOĞLU Et Al. }, title={Evaluation of Fatigue Behavior of Lead-Free Solder Joints in Four-Point Bending Test by Finite-Element Modeling}, journal={IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY}, year=2017, pages={1957-1964} }